The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Feb. 17, 2021
Applicant:
Jsp Corporation, Chiyoda-ku, JP;
Inventors:
Yohei Kaneko, Mie, JP;
Kenji Haraguchi, Mie, JP;
Assignee:
JSP CORPORATION, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 220/18 (2006.01); C08F 2/32 (2006.01); C08F 212/08 (2006.01); C08F 218/04 (2006.01); C08J 9/22 (2006.01);
U.S. Cl.
CPC ...
C08F 220/18 (2013.01); C08F 2/32 (2013.01); C08F 212/08 (2013.01); C08F 218/04 (2013.01); C08J 9/22 (2013.01);
Abstract
A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/mor more and 500 kg/mor less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×10or more and 2×10or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.