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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12590173 B1

PDFFull Text
Date of Patent:
Mar. 31, 2026

Filed:

Mar. 02, 2022

Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Takeshi Higuchi, Yokohama Kanagawa, JP;

Takahiro Iwasaki, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Holtz, Holtz & Volek PC

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

David L Miller

Int. Cl.
CPC ...
C08F 30/08 (2006.01); C08F 28/02 (2006.01); C08F 216/14 (2006.01); C08F 220/38 (2006.01); C08F 222/24 (2006.01); C08F 228/02 (2006.01); C08F 230/08 (2006.01); G03F 7/00 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); C08F 128/02 (2006.01); C08F 212/14 (2006.01); C08F 216/02 (2006.01); C08F 216/04 (2006.01); C08F 216/06 (2006.01); C08F 216/08 (2006.01); C08F 220/28 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C08F 30/08 (2013.01); C08F 28/02 (2013.01); C08F 216/1466 (2013.01); C08F 216/1475 (2020.02); C08F 216/1483 (2020.02); C08F 216/1491 (2020.02); C08F 220/38 (2013.01); C08F 220/382 (2020.02); C08F 220/385 (2020.02); C08F 222/24 (2013.01); C08F 222/245 (2020.02); C08F 228/02 (2013.01); C08F 230/08 (2013.01); G03F 7/0002 (2013.01); H01L 21/76817 (2013.01); H01L 21/76877 (2013.01); H01L 23/53295 (2013.01); C08F 128/02 (2013.01); C08F 212/30 (2020.02); C08F 216/02 (2013.01); C08F 216/04 (2013.01); C08F 216/06 (2013.01); C08F 216/08 (2013.01); C08F 216/085 (2020.02); C08F 220/287 (2020.02); C08F 222/102 (2020.02);
Abstract

According to one embodiment, a composition including a compound is provided. The compound includes a linking group containing 2 to 18 carbon atoms, a polymerizable functional group bonded to the linking group, a first reactive group bonded to the linking group, and a second reactive group bonded to the linking group. The polymerizable functional group includes at least one of a (meth)acryloyl group or a vinyl group. The first reactive group includes at least one selected from the group consisting of a thiol group, a disulfide group, and a thiocyanate group. The second reactive group includes at least one selected from the group consisting of an alkoxysilane group, a chlorosilane group, and a hydroxyl group.

Find Patent Forward Citations

Higuchi, Takeshi. (2026). Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device (U.S. Patent No. 12590173). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12590173

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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