The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

May. 22, 2020
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Andreas Ortner, Gau-Algesheim, DE;

Ulla Trinks, Mitterteich, DE;

Fabian Wagner, Mainz, DE;

Carsten Etz, Ingelheim, DE;

Daniela Seiler, Dittelsheim-Heßloch, DE;

Michael Kluge, Offenbach, DE;

Peter Czepelka, Mainz-Kostheim, DE;

Frank-Thomas Lentes, Bingen, DE;

André Witzmann, Waldershof, DE;

Reiner Artmann, Mitterteich, DE;

Assignee:

SCHOTT AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/09 (2006.01); C03B 17/04 (2006.01); C03B 17/06 (2006.01); C03B 18/02 (2006.01); C03B 33/095 (2006.01);
U.S. Cl.
CPC ...
C03B 33/091 (2013.01); C03B 17/04 (2013.01); C03B 17/067 (2013.01); C03B 18/02 (2013.01); C03B 33/0955 (2013.01);
Abstract

A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100° C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.


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