The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Nov. 04, 2021
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Sina Chaeichian, Walnut Creek, CA (US);

Kaspar Schaerer, Walnut Creek, CA (US);

Ruairi O′Kane, Oakland, CA (US);

Li Li, Walnut Creek, CA (US);

Michael D. Halbasch, Antioch, CA (US);

Martin Renkel, Duesseldorf, DE;

Omar L. Abu-Shanab, Rochester Hills, MI (US);

Brian Deegan, Blessington, IE;

Anna Esmeralda Javier, Eden Prairie, MN (US);

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 5/02 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 66/712 (2013.01); B29C 66/028 (2013.01); B29C 66/45 (2013.01); B29C 66/73141 (2013.01); B32B 5/024 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/18 (2013.01); B32B 27/285 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0007 (2013.01); B29L 2031/3076 (2013.01); B32B 2264/10 (2013.01); B32B 2307/212 (2013.01);
Abstract

This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.


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