The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
May. 21, 2021
Jtekt Corporation, Kariya, JP;
Yusuke Okubo, Aichi, JP;
Toshiyuki Baba, Nara, JP;
Kouji Kimura, Nara, JP;
Tomoya Adachi, Osaka, JP;
Hiroshi Kutsumi, Hyogo, JP;
Yoshiki Kojima, Nara, JP;
Satoshi Haraguchi, Kyoto, JP;
Sachiko Tachibana, Aichi, JP;
Shota Mizoguchi, Aichi, JP;
Toshihiro Moriuchi, Osaka, JP;
JTEKT CORPORATION, Kariya, JP;
Abstract
An injection molding device includes an injection device including a cylinder, a screw, and a nozzle provided at a front end of the cylinder, for discharging molten resin as the screw advances, a mold including a molded product cavity, and a resin channel between the molded product cavity and a portion abutting the nozzle, a channel pressure measuring device for acquiring channel pressure data in the resin channel, and a determination unit that determines presence/absence of clogging of a gate of the resin channel, based on features of the channel pressure data.