The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
May. 18, 2022
Persico S.p.a., Nembro, IT;
PERSICO S.P.A., Nembro, IT;
Abstract
Pressure moulding process, and related device (), for manufacturing an article, the process comprising: —providing a substrate () made of a composite material comprising a first polymeric material and fibres impregnated with said first polymeric material; —providing a coating sheet (); —heating said substrate () to a temperature of the substrate () greater than 160° C.; —subsequently, during a first compression step, compressing under pressure the substrate () and the coating sheet () between a first conformation surface () and a second conformation surface () for conforming the substrate () and the coating sheet () and for firmly fixing the substrate () and the coating sheet () to each other; —during a second compression step subsequent to the first compression step, compressing under pressure the substrate () and the coating sheet () between the first () and second conformation surface () and injecting a second polymeric material in an injection cavity () having an outlet mouth () onto the first conformation surface (), wherein a first face of the substrate () opposite to the coating sheet () is in contact with the first conformation surface (); —cooling the second polymeric material for firmly fixing the second polymeric material to the first face of the substrate (), wherein, during the first compression step, a temperature of the first () and second conformation surface () is less than 120° C.