The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
May. 04, 2021
Applicant:
Momentive Performance Materials Japan Llc, Tokyo, JP;
Inventors:
Horie Yutaka, Kanagawa, JP;
Benjamin Falk, Tarrytown, NY (US);
Qinghua Li, Kanagawa, JP;
Amar Pawar, Tarrytown, NY (US);
Koji Suenaga, Gunma, JP;
Assignee:
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61K 8/25 (2006.01); A61K 8/02 (2006.01); A61K 8/58 (2006.01); A61Q 1/06 (2006.01); A61Q 1/08 (2006.01); A61Q 1/10 (2006.01); A61Q 1/12 (2006.01); A61Q 5/02 (2006.01); A61Q 5/06 (2006.01); A61Q 5/12 (2006.01); A61Q 9/02 (2006.01); A61Q 11/00 (2006.01); A61Q 15/00 (2006.01); A61Q 17/00 (2006.01); A61Q 19/00 (2006.01); A61Q 19/10 (2006.01);
U.S. Cl.
CPC ...
A61K 8/25 (2013.01); A61K 8/025 (2013.01); A61K 8/585 (2013.01); A61Q 19/00 (2013.01); A61K 2800/412 (2013.01); A61K 2800/48 (2013.01); A61K 2800/52 (2013.01); A61K 2800/522 (2013.01); A61K 2800/524 (2013.01); A61Q 1/06 (2013.01); A61Q 1/08 (2013.01); A61Q 1/10 (2013.01); A61Q 1/12 (2013.01); A61Q 5/02 (2013.01); A61Q 5/06 (2013.01); A61Q 5/12 (2013.01); A61Q 9/02 (2013.01); A61Q 11/00 (2013.01); A61Q 15/00 (2013.01); A61Q 17/00 (2013.01); A61Q 19/007 (2013.01); A61Q 19/10 (2013.01);
Abstract
The present disclosure relates to silica particles comprising repeating units of (SiO) that are spherical in shape, which has the benefit of compatibility with personal care components and the resulting personal care applications. The present disclosure also relates to methods of preparing silica particles.