The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Apr. 08, 2024
Applicant:

Saucony, Inc., Waltham, MA (US);

Inventors:

Andrea A. Paulson, Waltham, MA (US);

Christopher J. Mahoney, Concord, MA (US);

Aaron P. St. Peter, Hampstead, NH (US);

Assignee:

Saucony, Inc., Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A43B 13/12 (2006.01); A43B 13/18 (2006.01); A43B 23/02 (2006.01); B29D 35/00 (2010.01); B29K 21/00 (2006.01); B29K 67/00 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
A43B 13/188 (2013.01); A43B 13/125 (2013.01); A43B 13/127 (2013.01); A43B 23/02 (2013.01); B29D 35/0054 (2013.01); B29K 2021/003 (2013.01); B29K 2067/00 (2013.01); B29K 2105/04 (2013.01);
Abstract

A footwear construction including a sole assembly, which can include a midsole including a midsole support wall forming a compartment and a compression molded core constructed from thermoplastic polyester elastomer (TPEE) disposed in the compartment and shielded from abrasion in the environment of the footwear in use via the midsole support wall. The core can be formed by compressing a foam core to increase its density, for example, from a first density between 0.05 g/cmand 0.08 g/cm, inclusive, to a second density between about 0.09 g/cmand 0.12 g/cm, inclusive. Such compression molding and the attendant density increase of the TPEE core can increase energy efficiency to at least 95% energy efficiency, when the midsole is installed in footwear. A related method of manufacture is provided.


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