The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Oct. 04, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Sheng-Nan Chen, Miao-Li County, TW;

Chia-Lin Yang, Miao-Li County, TW;

Kuan-Feng Lee, Miao-Li County, TW;

Jui-Jen Yueh, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/563 (2013.01); H01L 21/566 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 23/3121 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/182 (2013.01); H01L 2924/18301 (2013.01); H01L 2924/186 (2013.01);
Abstract

The present disclosure provides an electronic device including a first electronic unit, a second electronic unit, a circuit layer, a protection layer, and a flexible member. The first electronic unit is electrically connected to the second electronic unit through the circuit layer. The protection layer is disposed corresponding to the first electronic unit and the second electronic unit, and the protection layer has an opening. At least a portion of the flexible member is disposed in the opening. The protection layer has a first Young's modulus, the flexible member has a second Young's modulus, and the first Young's modulus is greater than the second Young's modulus.


Find Patent Forward Citations

Chen, Sheng-Nan. (2026). Electronic device and manufacturing method thereof (U.S. Patent No. 12588547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12588547

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…