The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Dec. 25, 2020
Applicant:

Sato Holdings Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yoshimitsu Maeda, Tokyo, JP;

Assignee:

SATO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/743 (2013.01); H01L 24/83 (2013.01); H01L 21/67144 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/82868 (2013.01); H01L 2224/82871 (2013.01); H01L 2224/82874 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83874 (2013.01);
Abstract

The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an ejection unit configured to eject a thermosetting adhesive toward a reference position of each antenna in the antenna continuous body; an IC chip placement unit configured to place an IC chip on the adhesive that is located on the reference position of each antenna in the antenna continuous body; a first light irradiator configured to irradiate the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface; and a second light irradiator configured to irradiate the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light.


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