The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Dec. 20, 2022
Qualcomm Incorporated, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
Disclosed are techniques for integrated circuits (ICs). In an aspect, an IC package includes a package substrate having an upper surface, a lower surface, a first side, and a second side perpendicular to the first side. The package substrate includes a metallization structure. The IC package further includes an IC die attached to the upper surface of the package substrate; first package bumps on the lower surface of the package substrate; and second package bumps on the lower surface of the package substrate. The first package bumps are arranged adjacent to one another along a diagonal direction that is diagonal to the package substrate, and the second package bumps are arranged adjacent to one another along the diagonal direction.