The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Dec. 20, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Youmin Yu, Escondido, CA (US);
Wei Wu, Irvine, CA (US);
Guoping Xu, San Diego, CA (US);
Nader Nikfar, San Diego, CA (US);
Assignee:
QUALCOMM INCORPORATED, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/70 (2026.01); H10W 70/685 (2026.01); H10W 76/12 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/70 (2026.01); H10W 70/685 (2026.01); H10W 76/161 (2026.01); H10W 90/00 (2026.01);
Abstract
A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.