The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Aug. 11, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seolyoung Choi, Yongin-si, KR;

Sun Kim, Hwaseong-si, KR;

Kyoungjun Kim, Yongin-si, KR;

Junghun Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/858 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8585 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
Abstract

A semiconductor light emitting device package includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; metal patterns disposed on the ceramic substrate to be spaced apart from the first and second electrode structures; an adhesive pattern disposed on the ceramic substrate between the adjacent metal patterns, the adhesive pattern having both side surfaces in contact with one side surface of the metal patterns and an upper surface positioned on a level below that of a lower surface of the light emitting diode chip; and a protector attached to the ceramic substrate by the adhesive pattern, the protector providing a cavity surrounding the light emitting diode chip.


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