The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Dec. 20, 2021
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventors:
David Henry, Grenoble Cedex, FR;
Alexis Rochas, Grenoble Cedex, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H10F 77/14 (2025.01); H10F 39/00 (2025.01); H10F 71/00 (2025.01); H10F 77/50 (2025.01); H10H 20/01 (2025.01); H10H 20/855 (2025.01);
U.S. Cl.
CPC ...
H10F 77/147 (2025.01); H10F 39/026 (2025.01); H10F 71/139 (2025.01); H10F 77/50 (2025.01); H10H 20/855 (2025.01); H10H 20/036 (2025.01);
Abstract
A method for collective bending of microelectronic components, including affixing an initial structure including a temporary handle and a plurality of microelectronic components, onto a shaping support, then removing the temporary handle, and bending the microelectronic components so that they are curved and adhere, by an adhesive layer, to the bent surfaces of the shaping support.