The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Mar. 02, 2023
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Tatsuo Shimizu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 12/01 (2025.01); H01L 21/04 (2006.01); H01L 21/324 (2006.01); H10D 30/66 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 12/031 (2025.01); H01L 21/0465 (2013.01); H01L 21/324 (2013.01); H10D 30/668 (2025.01); H10D 62/8325 (2025.01);
Abstract

A method of manufacturing a semiconductor device according to an embodiment includes: forming a mask material having an opening on a surface of a silicon carbide layer; forming a trench in the silicon carbide layer using the mask material as a mask; performing first ion implantation for implanting carbon (C) into a bottom face of the trench using the mask material as a mask; forming a sidewall material on a side face of the trench; performing second ion implantation for implanting a p-type first impurity into the bottom face of the trench using the sidewall material as a mask; and performing heat treatment at 1600° C. or more.


Find Patent Forward Citations

Shimizu, Tatsuo. (2026). Method of manufacturing semiconductor device and semiconductor device (U.S. Patent No. 12588227). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12588227

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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