The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Dec. 06, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Jens Pohl, Bernhardswald, DE;

Frank Püschner, Kelheim, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); G06K 19/077 (2006.01); G06V 40/13 (2022.01); H05K 1/11 (2006.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H05K 3/3431 (2013.01); G06K 19/07722 (2013.01); H05K 1/111 (2013.01); G06V 40/13 (2022.01); H05K 2201/09381 (2013.01); H05K 2201/10727 (2013.01);
Abstract

A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.


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