The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Jul. 19, 2022
Applicant:

Microchip Technology Caldicot Limited, Caldicot, GB;

Inventors:

John Adam Tracy Demercleden Smithells, Caldicot, GB;

Nina Biddle, Coleford, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/24 (2006.01); H05K 1/03 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 1/0298 (2013.01); H05K 1/144 (2013.01); H05K 3/007 (2013.01); H05K 3/243 (2013.01); H05K 1/0366 (2013.01); H05K 1/0393 (2013.01); H05K 1/111 (2013.01); H05K 1/119 (2013.01); H05K 1/181 (2013.01);
Abstract

A method includes providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof; applying a photoresist layer over the surface of the conductive electroplating seed layer; and defining wiring channels in the photoresist resist layer. The method includes electroplating a conductive material in the defined wiring channels; adhering a non-conductive layer over the photoresist layer and the plated conductive material in the wiring channels; and removing the layer of non-conductive material and the conductive electroplating seed layer.


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