The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Nov. 20, 2023
Applicant:

Sentec E&e Co., Ltd., Taoyuan City, TW;

Inventors:

Jason Huang, Taoyuan City, TW;

Liang-Yo Chen, Taoyuan City, TW;

Pi-Sheng Hsu, Taoyuan City, TW;

Chun-Ming Wei, Taoyuan City, TW;

Assignee:

SENTEC E&E CO., LTD., Taoyuan City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 1/44 (2007.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02M 1/44 (2013.01); H02M 7/003 (2013.01);
Abstract

A power apparatus includes a substrate, a first power circuit, and a second power circuit. The substrate includes a first metallization region, a second metallization region, and a third metallization region which are separated from each other. The first power circuit is electrically connected to the first metallization region and the third metallization region, and is arranged across the second metallization region and fails to be in contact with the second metallization region. The second power circuit is electrically connected to the second metallization region and the third metallization region, and fails to be in contact with the first metallization region.


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