The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Mar. 31, 2022
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;

Inventors:

Xinnan Wang, Qingdao, CN;

Dan Li, Qingdao, CN;

Benzheng Dong, Qingdao, CN;

Jiaao Zhang, Qingdao, CN;

Jianwei Mu, Qingdao, CN;

Long Zheng, Qingdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02345 (2021.01); H01S 5/02253 (2021.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02345 (2021.01); H01S 5/02253 (2021.01); H01S 5/0261 (2013.01); H01S 5/0264 (2013.01);
Abstract

An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.


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