The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Jun. 15, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Chang Ho Seo, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/0085 (2013.01); H01G 4/30 (2013.01);
Abstract
A multilayer electronic component and a method of manufacturing the same are disclosed. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and external electrodes disposed on the body and connected to the internal electrodes, wherein at least one of the internal electrodes contains a metal oxide at one of end portions thereof.
Quick Actions:
Seo, Chang. (2026). Multilayer electronic component and method of manufacturing the same (U.S. Patent No. 12586719). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12586719
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile