The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Jul. 25, 2023
Sandisk Technologies, Inc., Milpitas, CA (US);
Keyur Payak, Santa Clara, CA (US);
Khin Htoo, Danville, CA (US);
Primit Modi, Fremont, CA (US);
Tushar Negi, Milpitas, CA (US);
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
Embodiments of the present technology provide a memory die that estimates ICC peak using cost effective (and small area) on-memory die components and processing circuitry. The memory die leverages a temperature sensor to estimate a temperature rise for a substrate region of the memory die located proximate to a wordline ramp up pump during a wordline ramp up process performed before a read operation. Based on the estimated temperature rise for the substrate region, the memory die can determine that an ICC peak of the memory die deviates from a target ICC peak value—and adjust parameters of the wordline ramp up process in a manner that brings the ICC peak of the memory die closer to the target ICC peak value.