The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Sep. 15, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jonghyeok Kim, Suwon-si, KR;

Myungjin Choi, Suwon-si, KR;

Yoongi Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/327 (2020.01); G06F 30/394 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/327 (2020.01); G06F 30/394 (2020.01);
Abstract

A method of designing a layout of a semiconductor integrated circuit, including receiving input data defining the semiconductor integrated circuit; determining a first layout of the semiconductor integrated circuit by performing a placement and routing (P&R) procedure based on the input data, wherein the first layout includes a plurality of blocks, a plurality of standard cells, a plurality of power wirings, a plurality of ground wirings, a plurality of clock wirings, and a plurality of signal wirings; selecting a target region of the first layout, wherein the target region is capable of accommodating at least one additional power wiring and at least one additional ground wiring; and determining a second layout of the semiconductor integrated circuit by modifying the first layout to include the at least one additional power wiring and the at least one additional ground wiring in the target region.


Find Patent Forward Citations

Kim, Jonghyeok. (2026). Method of designing layout of semiconductor integrated circuit, method of designing and manufacturing semiconductor integrated circuit using the same, and design system performing same (U.S. Patent No. 12585855). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12585855

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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