The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Jul. 31, 2023
Applicant:

Accenture Global Solutions Limited, Dublin, IE;

Inventors:

Kuntal Dey, Birbhum, IN;

Kapil Singi, Bangalore, IN;

Vibhu Saujanya Sharma, Bangalore, IN;

Vikrant Shyamkant Kaulgud, Pune, IN;

Adam Patten Burden, Tampa, FL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 8/77 (2018.01); G06F 11/3668 (2025.01);
U.S. Cl.
CPC ...
G06F 8/77 (2013.01); G06F 11/3672 (2013.01);
Abstract

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating and updating project plans for software development projects. In one aspect, a method includes obtaining data indicative of initial project plan parameters associated with a software development project; identifying multiple program modules associated with the software development project; obtaining, for a first set of modules of the multiple modules, corresponding source code segments; executing a quality assessment process to compute, for each corresponding source code segment, a corresponding quality score; identifying, based on the quality scores, that at least a subset of the corresponding source code segments are integrable into a corresponding first subset of the first set of modules; and generating a revised project plan by generating updates to the initial project plan parameters by accounting for the corresponding source code segments being integrated in to corresponding ones of the first set of modules.


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