The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Dec. 26, 2023
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Yin Qian, Milpitas, CA (US);

Lindsay Alexander Grant, Campbell, CA (US);

Sunny Yat-San Ng, San Jose, CA (US);

Hongli (Henry) Yang, Saratoga, CA (US);

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/00 (2006.01); G02F 1/133 (2006.01); G02F 1/1335 (2006.01); G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G09G 3/36 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13306 (2013.01); G02F 1/133553 (2013.01); G02F 1/13439 (2013.01); G02F 1/136277 (2013.01); G09G 3/36 (2013.01); G02B 27/0172 (2013.01); G02B 2027/0178 (2013.01); G02F 2203/02 (2013.01); G09G 2330/021 (2013.01); G09G 2340/00 (2013.01); G09G 2360/18 (2013.01); G09G 2370/00 (2013.01);
Abstract

An example liquid crystal display device includes a reflective display backplane and one or more integrated circuit substrates arranged in a stacked configuration. The reflective display backplane includes an array of reflective pixel mirrors and a corresponding array of data latches. The top face of one integrated circuit substrate is connected to the back side of the reflective display backplane and is configured as a display driver, providing control signals to the reflective display backplane using a set of through-silicon-vias. Optionally, another integrated circuit substrate is connected (face-to-back) to the one integrated circuit substrate and is configured to provide virtual reality, augmented reality, and/or other video processing support to the display driver. An example embodiment is provided with a chip-scale-package structure formed on the bottom integrated circuit substrate of the stack.


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