The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Apr. 03, 2023
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Mikimoto Jin, Ina, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 3/44 (2006.01); G01P 15/125 (2006.01); G01P 15/18 (2013.01);
U.S. Cl.
CPC ...
G01P 3/44 (2013.01); G01P 15/125 (2013.01); G01P 15/18 (2013.01);
Abstract

A sensor unit includes: a substrate including a first coupling portion disposed on a first surface and a second coupling portion disposed on a second surface; a first sensor module including a first coupled portion that is located on a side close to the first surface and that is coupled to the first coupling portion, a first acceleration sensor, and a first angular velocity sensor; and a second sensor module including a second coupled portion that is located on a side close to the second surface and that is coupled to the second coupling portion, a second acceleration sensor, and a second angular velocity sensor.


Find Patent Forward Citations

Jin, Mikimoto. (2026). Sensor unit with dual overlapping modules (U.S. Patent No. 12584937). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12584937

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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