The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Dec. 08, 2020
Applicant:
Mitsubishi Cable Industries, Ltd., Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI CABLE INDUSTRIES, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 3/10 (2006.01); H01L 23/29 (2006.01); H10W 74/47 (2026.01);
U.S. Cl.
CPC ...
C09K 3/1009 (2013.01); H10W 74/476 (2026.01); C09K 2200/0247 (2013.01); C09K 2200/0607 (2013.01);
Abstract
A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.
Yasuda, Hiroaki. (2026). Semiconductor production device sealing material (U.S. Patent No. 12584054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12584054
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile