The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Oct. 14, 2022
Tohoku University, Sendai, JP;
Canon Anelva Corporation, Kawasaki, JP;
Takehito Shimatsu, Sendai, JP;
Miyuki Uomoto, Sendai, JP;
Kazuo Miyamoto, Saitama, JP;
Yoshikazu Miyamoto, Saitama, JP;
Nobuhiko Katoh, Kawasaki, JP;
Takayuki Moriwaki, Kawasaki, JP;
Takayuki Saitoh, Kawasaki, JP;
TOHOKU UNIVERSITY, Sendai, JP;
CANON ANELVA CORPORATION, Kawasaki, JP;
Abstract
Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.