The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Mar. 06, 2024
Seiko Epson Corporation, Tokyo, JP;
Masashi Fuchii, Minowa-machi, JP;
Yimei Ding, Shiojiri, JP;
Naoki Iizuka, Shiojiri, JP;
Hidenobu Maruyama, Azumino, JP;
Kenta Anegawa, Matsumoto, JP;
Yasuto Kanai, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
An injection molding system includes a molding device, an inspection device configured to inspect a molded product and a control device that includes a storage unit, and a reception unit configured to receive a change content of a parameter included in a standard molding condition. The control device executes a first control of forming the molded product under a second molding condition in which the parameter is changed based on the change content, a second control of forming the molded product under a third molding condition in which the same parameter is changed, a third control of associating the second molding condition with an inspection result of the molded product formed under the second molding condition and storing the association, and a fourth control of associating the third molding condition with the inspection result of the molded product formed under the third molding condition and storing the association.