The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Aug. 16, 2023
Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;
Hirofumi Murata, Hanishina-gun, JP;
Kenichi Hayashi, Hanishina-gun, JP;
NISSEI PLASTIC INDUSTRIAL CO., LTD., Nagano-Ken, JP;
Abstract
A predetermined mold gap is provided beforehand between a movable mold and a stationary mold of a mold by a mold clamping device. A mold clamping pressure is set to zero, and a predetermined back pressure is set for the movable mold. Subsequently, the injection device is caused to start injection of the molten resin into the mold for which the mold gap, the mold clamping pressure, and the back pressure have been set. When a predetermined injection end condition set beforehand is satisfied as a result of progress of an injection filling process, a filling end process of ending the injection filling process is performed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile