The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Apr. 07, 2022
Applicant:

Precitec Gmbh & Co. KG, Gaggenau, DE;

Inventors:

Tom Walde, Offenburg, DE;

Rüdiger Moser, Malsch, DE;

Igor Shkarban, Rheinstetten, DE;

Dejan Miletic, Mannheim, DE;

Assignee:

Precitec GmbH & Co. KG, Gaggenau, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/064 (2014.01); B23K 26/08 (2014.01); B23K 26/082 (2014.01); B23K 26/24 (2014.01); G01B 5/00 (2006.01); G01B 9/02091 (2022.01); G01B 11/22 (2006.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/082 (2015.10); B23K 26/0876 (2013.01); B23K 26/24 (2013.01); G01B 5/0037 (2013.01); G01B 11/22 (2013.01); G01B 9/02091 (2013.01);
Abstract

A method for determining a depth of a vapor capillary during laser machining includes: irradiating a machining laser beam onto a workpiece to form the capillary, the beam deflected by a first deflection device along a machining path within a first scan field, irradiating an optical measuring beam onto the workpiece, the measuring beam deflected by a second deflection device relative to the machining laser beam along a scanning path within a scanning area and then together with the machining laser beam by the first deflecting device, acquiring measured distance values along the path based on part of the measuring beam reflected by the workpiece, determining a depth/position of the capillary based on the acquired measured distance values. The scanning area size is based on a position of the laser beam and/or deflection of the laser beam by the first deflection device. A corresponding laser machining system is also provided.


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