The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Nov. 21, 2023
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Keiichi Kobayashi, Sagamihara, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01); H10F 77/00 (2025.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); A61B 1/0011 (2013.01); A61B 1/051 (2013.01); H01L 24/08 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H10F 39/12 (2025.01); H10F 39/811 (2025.01); H10F 77/93 (2025.01); H01L 2224/0219 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/131 (2013.01);
Abstract

An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface; and a bonding terminal which is made of solder, covers a surface of the solder resist film placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the solder resist film.


Find Patent Forward Citations

Kobayashi, Keiichi. (2026). Image pickup unit having resin in via holes for an endoscope (U.S. Patent No. 12582294). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12582294

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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