The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Sep. 03, 2021
Applicant:

Jt International SA, Geneva, CH;

Inventors:

Kyle Adair, Lisburn, GB;

Peter Loveday, Epsom, GB;

Olayiwola Olamiposi Popoola, Walton-on-Thames, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); A24F 40/40 (2020.01); H05K 1/02 (2006.01); H05K 1/189 (2026.01);
U.S. Cl.
CPC ...
A24F 40/40 (2020.01); H05K 1/0281 (2013.01); H05K 1/189 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A printed circuit board is configured to mechanically support a plurality of electrical and/or electronic components which are electrically connected via conductive tracks. At least some of the conductive tracks are arranged on a common flexible carrier. A first rigidizing layer including a first rigidizing material is located at a first portion of a surface of the common flexible carrier to form a first rigidized zone. A second rigidizing layer including a second rigidizing material is located at a second portion of the surface of the common flexible carrier to form a second rigidized zone. The first portion of the surface and the second portion of the surface are spaced apart from each other. The first rigidizing material and the second rigidizing material support electrical and/or electronic components. The electrical, electronical components and/or conductor tracks are attached between the rigidizing layers.


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