The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Mar. 31, 2022
Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yifan Wu, Beijing, CN;
Yue Li, Beijing, CN;
Yuelei Xiao, Beijing, CN;
Kidong Han, Beijing, CN;
Qichang An, Beijing, CN;
Yulin Feng, Beijing, CN;
Xue Cao, Beijing, CN;
Wenbo Chang, Beijing, CN;
Yi Zhou, Beijing, CN;
Lihui Wang, Beijing, CN;
Qiuxu Wei, Beijing, CN;
Feng Qu, Beijing, CN;
Beijing BOE Optoelectronics Technology Co., Ltd., Beijing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
Provided are a substrate, a method for preparing the substrate, an integrated passive device, and an electronic apparatus. The method for preparing the substrate includes: providing a base substrate including at least one blind via, wherein the base substrate includes a first surface and a second surface disposed oppositely, a blind via extends from a first surface side to interior of the base substrate, and an aperture of the blind via gradually decreases in a direction from the first surface to the second surface; forming a connection electrode in the blind via; thinning the base substrate along a direction from the second surface to the first surface, wherein the blind via on the thinned base substrate forms a via hole penetrating the base substrate.