The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Aug. 12, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takuya Kadoguchi, Toyota, JP;

Takanori Kawashima, Toyota, JP;

Shinji Hiramitsu, Kariya, JP;

Shoichiro Omae, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya-city, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/34 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 25/072 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/27849 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes a semiconductor element having a surface on which a first electrode and a second electrode are disposed, a conductor plate having a surface facing the surface of the semiconductor element and electrically connected to the first electrode, an insulating layer disposed on the surface of the conductor plate and covers a part of the surface of the conductor plate, and a conductor circuit pattern disposed on the insulating layer. The conductor circuit pattern has at least one conductor line electrically connected to the semiconductor element. The at least one conductor line includes a conductor line electrically connected to the second electrode.


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