The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Mar. 29, 2023
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Tianzhu Fan, Houston, TX (US);

Jae Seung Lee, Ann Arbor, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/49861 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/95 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/19 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2224/95 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A method for manufacturing a power device fabrication panel includes aligning a first alignment mark in a lead frame of a power device substrate array with a second alignment mark in a bonding fixture. The power device substrate array includes a plurality of power device pockets, the bonding fixture includes a plurality of power device openings, and the power device openings are in assembly alignment with the power device pockets when the first alignment mark is aligned with the second alignment mark. And with the bonding fixture power device openings in assembly alignment with the power device pockets of the power device substrate array, a plurality of power devices are moved at least partially through the aligned power device openings and into the power device pockets where they are bonded.


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