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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12581956 B1

PDFFull Text
Date of Patent:
Mar. 17, 2026

Filed:

Dec. 16, 2022

Through molding contact enabled emi shielding

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Je-Hsiung Lan, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Ranadeep Dutta, Del Mar, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/563 (2013.01); H01L 21/566 (2013.01); H01L 21/568 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/14215 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/2027 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Disclosed are examples of multi-die modules that includes a die (e.g., a power amplifier) and an adjacent die placed side-by-side and bonded onto a substrate with a mold compound. The die (e.g., a switch or a low noise amplifier) may be double EMI shielded to minimize or even eliminate EMI/noise coupling with the adjacent die (e.g., switch, low noise amplifier, etc.). Another mold compound, which can be thermally conductive, may be provided to improve transfer of heat away from the die and/or the adjacent die.

Find Patent Forward Citations

Lan, Je-Hsiung. (2026). Through molding contact enabled emi shielding (U.S. Patent No. 12581956). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12581956

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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