The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Jan. 14, 2021
3m Innovative Properties Company, St. Paul, MN (US);
Samuel J. Carpenter, Maplewood, MN (US);
Aaron K. Nienaber, Lake Elmo, MN (US);
Joseph B. Eckel, Vadnais Heights, MN (US);
Ronald D. Jesme, Plymouth, MN (US);
Jacob P. Podkaminer, St. Paul, MN (US);
Victor Ho, St. Paul, MN (US);
Sebastian Goris, Inver Grove Heights, MN (US);
Matthew T. Johnson, Woodbury, MN (US);
Michael S. Graff, Woodbury, MN (US);
Steven H. Kong, Woodbury, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1−0.17 V+0.002 V.