The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Dec. 18, 2020
Applicant:

University of Science and Technology of China, Hefei, CN;

Inventors:

Lin Cheng, Hefei, CN;

Dongfang Pan, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01); H02M 3/00 (2006.01); H02M 3/335 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/5223 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H02M 3/003 (2021.05); H02M 3/33569 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48132 (2013.01); H01L 2224/48139 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An isolated power chip based on wafer level packaging, including: an RDL-based micro-transformer, where a primary coil of the RDL-based micro-transformer is connected to a direct-current power supply and configured to output a direct-current voltage input by the direct-current power supply; a transmitting chip connected to the primary coil of the RDL-based micro-transformer, and configured to receive the direct-current voltage, convert the direct-current voltage into an alternating current signal, and transmit the alternating current signal to a secondary coil of the RDL-based micro-transformer; and a receiving chip connected to the secondary coil of the RDL-based micro-transformer, and configured to convert the alternating current signal into a direct-current signal, generate a control signal for stabilizing the output voltage according to a change of a load, and encode the control signal for digital isolation. The present disclosure further provides a method of manufacturing an isolated power chip based on wafer level packaging.


Find Patent Forward Citations

Cheng, Lin. (2026). Isolated power chip based on wafer level packaging and method of manufacturing the same (U.S. Patent No. 12581945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12581945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…