The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Jul. 03, 2023
Applicant:
Rf360 Singapore Pte. Ltd., Singapore, SG;
Inventors:
Poh Hoong Yong, Johor Bahru, MY;
Siew Li Poh, Singapore, SG;
Ren Bin Yang, Singapore, SG;
Shan Chen, Singapore, SG;
Assignee:
RF360 SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/5226 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01);
Abstract
An integrated device comprising a die substrate; a die interconnection portion coupled to the die substrate; and a metallization interconnect coupled to the die interconnection portion. The metallization interconnect comprises an adhesion metal layer, a first metal layer coupled to the adhesion metal layer; a second metal layer coupled to the first metal layer, and a third metal layer coupled to the second metal layer.