The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Sep. 24, 2021
Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Yasuyuki Oyama, Tokyo, JP;

Emi Miyazawa, Tokyo, JP;

Yuta Akasu, Tokyo, JP;

Shogo Sobue, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); C08G 59/42 (2006.01); H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); C08G 59/42 (2013.01); H01L 21/30 (2013.01); H01L 21/683 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A film for temporary fixing used for temporarily fixing a semiconductor member and a support member contains a curable resin component. The storage modulus at 270° C. after curing of the film for temporary fixing is 1.5 to 20 MPa. The storage modulus at 25° C. after curing of the film for temporary fixing is 1.5 to 150 MPa.


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