The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Feb. 23, 2023
Applicant:

Ngk Insulators, Ltd., Nagoya City, JP;

Inventors:

Masato Misaki, Handa City, JP;

Koichi Yoshino, Nagoya City, JP;

Akiyoshi Hattori, Nagoya City, JP;

Kazuhiro Nobori, Handa City, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01);
Abstract

A cooling plate according to the present invention contains 42% to 65% by mass of TiSi, 4% to 16% by mass of TiC, and a smaller amount of SiC than the mass percentage of TiSi.


Find Patent Forward Citations

Misaki, Masato. (2026). Cooling plate and member for semiconductor manufacturing apparatus (U.S. Patent No. 12581904). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12581904

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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