The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Mar. 07, 2022
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Koichi Takasaki, Tokyo, JP;

Makoto Miura, Tokyo, JP;

Makoto Satake, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01J 37/32 (2006.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); H01J 37/3211 (2013.01); H01J 37/32651 (2013.01); H01J 2237/3341 (2013.01); H01J 2237/3346 (2013.01); H10D 30/6735 (2025.01);
Abstract

An object of the present invention is to provide a highly controllable plasma processing method capable of selectively removing a metal-containing layer. In the plasma processing method for plasma etching a metal-containing film formed on a formed pattern and covered with a carbon-containing film, after the carbon-containing film is removed, the metal-containing film is removed by etching with radicals generated from plasma.


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