The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Jan. 09, 2023
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yunhan Xiao, Beijing, CN;

Fan Li, Beijing, CN;

Congcong Li, Beijing, CN;

Dong Wang, Beijing, CN;

Huinan Shi, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 3/044 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/111 (2013.01); G06F 3/0446 (2019.05); G06F 2203/04112 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A flexible printed circuit board includes a main flexible board and a bridging flexible board, wherein the main flexible board includes a first main pad, a second main pad, a first signal line and a second signal line, and the bridging flexible board includes a first bridging pad and a second bridging pad; the first main pad includes at least two first solder joints, the second main pad includes at least two second solder joints, the first bridging pad includes at least two third solder joints, and the second bridging pad includes at least two fourth solder joints.


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