The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

May. 05, 2022
Applicant:

Nvidia Corp., Santa Clara, CA (US);

Inventors:

Mingyi Yu, Saratoga, CA (US);

Greg Bodi, Santa Cruz, CA (US);

Ananta Attaluri, San Jose, CA (US);

Assignee:

NVIDIA Corp., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0262 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout. A method of manufacturing a printed circuit board includes forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package, mounting the integrated circuit package over the cutout on a first side of the printed circuit board, coupling a power regulator to power terminals of the integrated circuit package through the cutout, and interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.


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