The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Aug. 25, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yingwei Liu, Beijing, CN;

Zhonglan Zhao, Beijing, CN;

Zhanfeng Cao, Beijing, CN;

Ke Wang, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03H 1/00 (2006.01); H03H 3/00 (2006.01); H03H 7/01 (2006.01);
U.S. Cl.
CPC ...
H03H 1/00 (2013.01); H03H 3/00 (2013.01); H03H 7/0115 (2013.01); H03H 2001/0078 (2013.01);
Abstract

A filter, a manufacturing method therefor, and an electronic device are provided. The filter includes a first substrate and a second substrate disposed opposite to each other, and a connection substrate disposed therebetween, wherein at least one first substrate electrode is disposed on the first substrate, at least one second substrate electrode is disposed on the second substrate, the connection substrate comprises, at least, a connection base substrate and at least one conductive post penetrating the connection base substrate in a thickness direction, an end of the conductive post close to the first substrate is provided with a first bump structure, an end of the conductive post close to the second substrate is provided with a second bump structure, and the first bump structure is connected with the first substrate electrode, the second bump structure is connected with the second substrate electrode, both in a bonding manner.


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