The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Feb. 23, 2021
Applicant:

Mektec Corporation, Tokyo, JP;

Inventors:

Shuzo Yamada, Tokyo, JP;

Yu Miura, Tokyo, JP;

Tomoki Kanayama, Tokyo, JP;

Assignee:

MEKTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/68 (2011.01); H01R 12/62 (2011.01); H01R 12/69 (2011.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01R 12/69 (2013.01); H01R 12/62 (2013.01); H01R 12/68 (2013.01); H05K 3/361 (2013.01);
Abstract

A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a part of the circuit. A part of the circuit is exposed without the cover film being provided in a partial region of the flexible printed wiring board, and at least some of the crimping pieces are arranged in the partial region, and thus bite into a part of the circuit without penetrating the cover film.


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