The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Mar. 14, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Akihiko Oide, Tokyo, JP;

Makoto Yoshino, Tokyo, JP;

Tomoki Okada, Yurihonjo-city, JP;

Masashi Shimoyasu, Tokyo, JP;

Daiki Kato, Tokyo, JP;

Hideki Saitou, Yurihonjo-city, JP;

Seiji Osada, Yurihonjo-city, JP;

Kazuhiro Ebina, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2847 (2013.01); H01F 17/0006 (2013.01); H01F 27/292 (2013.01); H01F 41/04 (2013.01); H01F 2017/0073 (2013.01);
Abstract

In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.


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