The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Jun. 30, 2025
Applicants:

China Academy of Machinery Wuhan Research Institute of Materials Protection Co. Ltd., Wuhan, CN;

China Hubei Longzhong Laboratory, Xiangyang, CN;

Inventors:

Haitao Duan, Wuhan, CN;

Dan Jia, Wuhan, CN;

Jinhong You, Wuhan, CN;

Wulin Zhang, Wuhan, CN;

Shengpeng Zhan, Wuhan, CN;

Yu Cheng, Wuhan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 5/04 (2006.01); G01N 3/56 (2006.01);
U.S. Cl.
CPC ...
G01N 5/04 (2013.01); G01N 3/56 (2013.01);
Abstract

A grinding simulation test device and method for a steel turnout rail of rail transit are provided. The device includes a rotary unit, a reciprocating unit, a turnout swinging unit, and a pressurizing unit. The rotary unit includes a grinding tool rotary mechanism, a temperature monitoring mechanism and a turnout grinding tool. A movable end of the grinding tool rotary mechanism is detachably connected to the turnout grinding tool through a torque sensor, to thereby drive the turnout grinding tool to rotate and monitor a torque. The temperature monitoring mechanism is configured to monitor temperatures during a grinding process. Through the reciprocating unit, the rotary unit, the turnout swinging unit and the pressurizing unit, four main influencing parameters, namely, moving speed, rotary speed, grinding angle and grinding pressure of a grinding tool, are disassembled into four independent parameters, thereby improving controllability and operability of each single parameter under laboratory conditions.


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