The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Oct. 26, 2022
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Zhengmao Lu, Cambridge, MA (US);

Arny Leroy, Montreal, CA;

Evelyn N. Wang, Cambridge, MA (US);

Jeffrey C. Grossman, Brookline, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 25/00 (2006.01); F24F 5/00 (2006.01); F25B 19/00 (2006.01); F25B 23/00 (2006.01); F25B 39/02 (2006.01);
U.S. Cl.
CPC ...
F25B 25/00 (2013.01); F25B 19/00 (2013.01); F25B 23/003 (2013.01); F25B 39/02 (2013.01); F24F 5/0035 (2013.01);
Abstract

Hybrid evaporative and radiative cooling panel systems having increased cooling efficiency while minimizing water consumption are provided. The disclosed hybrid systems include a cooling panel that enables the improved cooling and water consumption via a reflector layer which reflects solar radiation, an evaporative and infrared-emitting layer that is solar-transparent and water-rich, and an insulation layer that is vapor-permeable, infrared-transparent, and solar-reflecting. The cooling panel is configured to be in fluid communication with a heat exchanger. The cooling panel is further configured to cool a heat transfer fluid by way of both evaporative cooling and radiative cooling. The cooling panel is also configured such that the heat transfer fluid passes at least one of through or across the cooling panel and flows to the heat exchanger. Various configurations of such panels and panel systems, and methods of implementing the principles associated with the same, are also disclosed.


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