The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Sep. 13, 2023
Seiko Epson Corporation, Tokyo, JP;
Masahiko Nakazawa, Matsumoto, JP;
Shigemi Wakabayashi, Azumino, JP;
Takashi Shinohara, Matsumoto, JP;
Takumi Sago, Matsumoto, JP;
Naoko Omagari, Azumino, JP;
Masahide Nakamura, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A method for manufacturing a molded product of the present disclosure includes a deposition step of depositing a mixture including a fiber and starch in air, a humidification step of applying water to the mixture, and a molding step of heating and pressurizing the mixture applied with water to obtain a molded product. The starch has a gelatinized and then pulverized particle diameter d50 of 0.30 mm or more and 1.0 mm or less, which is the average particle diameter of the finely pulverized product determined by a prescribed measuring method.